More than 30 years of experience are our guarantee as manufacturers
of high-quality printed circuit boards for professional electronics.
Effort, professionalism and know-how are the mainstays of the company's workforce.
The continuous improvement in our processes has always been a constant in our organisation.
We work based on the customer's design. Our technical staff collaborates and
advises to guarantee the quality of the product from the very start.
Multilayer Printed Circuit Boards
Electronic technology continuously tends to focus its development on reducing the size and increasing the capacity of the printed circuit boards. This constant evolution of microelectronics has had a great impact on the development of printed circuit boards.
In response to this greater demand for interconnection by surface unit, in 2008 TECCI strengthened its productive capacity incorporating state-of-the-art lines and machinery for the manufacture of prototypes and small series of multilayer circuits up to 8 layers, with a capacity to manufacture 1000 m2 per month at our facilities.
Download technical specifications
Technical Capacities
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Standard |
Special |
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Materials |
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Type |
FR4 Tg 135ºC |
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Other materials to order |
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FR4 Tg 135ºC AntiCAf |
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FR4 Tg 150ºC AntiCAf |
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FR4 Tg 170ºC AntiCAf |
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FR4 Tg 150ºCAntiCAf-Halogen free CTI 2 |
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Internal Layers |
0,25mm |
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Other thicknesses to order |
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0,36mm |
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0,50mm |
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0,71mm |
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Prepregs |
1080---0.65mm |
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Other thicknesses to order |
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2116---0.115mm |
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7628---0.190mm |
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Stack-up |
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Total thickness |
0,8-2,4 |
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Initial copper thickness |
18-35-70 |
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Other thicknesses to order |
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Maximum number of layers |
8 |
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Silkscreen Printing Inks |
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Photosensitive Mask |
Green, Black, Blue, Red |
White LED |
Other colours to order |
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Silkscreen Components |
White, Black, Yellow |
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Other colours to order |
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Graphite |
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Yes |
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Peelable Ink |
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Yes |
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Surface Finishes |
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HASL Sn/Cu |
Yes |
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HASL Sn/Pb |
Yes |
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Chemical Tin |
Yes |
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OSP |
Subcontracted |
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ENIG |
Subcontracted |
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Hard Gold |
Subcontracted |
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Mix of surface finishes |
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Chemical Tin + Nickel-Gold Connector |
No |
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HASL + Nickel-Gold Connector |
Yes |
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ENIG + Nickel-Gold Connector |
Yes |
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Minimum drill hole diameter |
0,30 mm |
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Minimum diameter of metallised drill hole |
0,20 mm |
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Scoring |
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Angle |
30º |
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Milling |
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Standard milling cutter diameter |
2 mm |
1-1,6-3,2 |
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Capacities internal layers |
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Minimum Width of the conductor |
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Base copper 17µm |
127µm |
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Base copper 35µm |
150µm |
127µm |
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Base copper 70µm |
200µm |
175µm |
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Minimum conductor space: (Airgap) |
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Base copper 17µm |
127µm |
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Base copper 35µm |
150µm |
127µm |
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Base copper 70µm |
200µm |
175µm |
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Minimum insulations |
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Minimum insulation between final drill hole and antipad |
Final drill hole + 0,65 |
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Aislamiento mínimo entre pads y antipads |
Tamaño de Pad + 0,60 |
Tamaño de pad + 0,45 |
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Minimum insulation between final pads and antipad |
Size of Pad + 0,45 |
Size of Pad + 0,35 |
With Teardrops |
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General |
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Distance between conductor and plate edge |
0,5 mm |
With milling 0,2 MM |
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Capacities External Layers |
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Minimum Width of the conductor |
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Base copper external layers 17µm |
150 µm |
127µm |
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Base copper external layers 35µm |
175 µm |
150µm |
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Base copper external layers 70µm |
225 µm |
200µm |
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Minimum space between conductors: (Airgap) |
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Base copper external layers 17µm |
150 µm |
127µm |
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Base copper external layers 35µm |
175 µm |
150µm |
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Base copper external layers 70µm |
225 µm |
200µm |
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Distances Pad-Metallised drill hole |
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Minimum pad for metallised drill hole |
final hole size +0,35 |
final hole size + 0,25 |
With Teardrops |
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General |
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Distance between conductor and plate edge |
0,5 mm |
WITH ROUTING 0,2 MM |
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Soldermask |
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Minimum width of Mask outline |
100µm |
80µm |
For green ink |
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Crown of Mask |
100µm |
75µm |
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Thickness of mask on metal |
5/30µm |
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Mask register |
125µm |
75µm |
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Electric test |
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Continuity Resistance |
30 ohm |
10 ohm |
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Voltage of the Test |
150-200 V |
250 V |
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Insulation Resistance |
25 Mohm |
100 Mohm |
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Maximum size Test template |
230x300 |
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Maximum testable size FlyingProbe |
457x610 |
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Minimum distance between test points |
0,18 mm |
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Minimum distance between test pads |
0,08 mm |
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Documentation |
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Documentation files format |
GERBERS, DPF |
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Drilling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Drilling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Electrical files format |
IPC 356 |
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Comparison netlist format |
IPC 356 |
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Tolerances
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Standard |
Special |
Comments |
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Stack-up |
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Total thickness of the circuit (1,6mm) |
±0,16 |
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Flatness |
1,0% |
0,8% |
Special tolerances to order |
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Drilling capacities |
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Drill hole position tolerance |
±0,075 |
±0,05 |
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Scoring |
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Real position |
±0,125 |
±0,1 |
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Milling |
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Milling tolerance |
x<25,4mm: ±0,1. |
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Depending on the thickness of the circuit/p> |
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Internal milling hole tolerances |
x<25,4mm: ±0,1. |
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Depending on the size |
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Internal Layers |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
±20% |
±10% |
Special tolerances to order |
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Initial thickness internal copper 35 µ |
±25% |
±20% |
Special tolerances to order |
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Initial thickness internal copper 70 µ |
±25% |
±20% |
Special tolerances to order |
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External layers after metallisation |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
±20% |
±10% |
Special tolerances to order |
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Initial thickness internal copper 35 µ |
±25% |
±20% |
Special tolerances to order |
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Initial thickness internal copper 70 µ |
±25% |
±20% |
Special tolerances to order |
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General |
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Variation register layer to layer |
±0,125 |
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Polígono industrial Aranaztegi
Avenida Aranaztegi, 8
20140 Andoain Gipuzkoa (Spain)
Tel.:
+34 943 ... view telephone
Fax:
+34 943 ... view fax
comercial@tecci.com
PROYECTO ACTIVE
INVESTIGACIÓN Y DESARROLLO DE NUEVA GENERACIÓN DE PRODUCTOS FUNCIONALES CON CAPACIDAD DE INTERACCIÓN CON EL ENTORNO EN EVOLUCIÓN
El proyecto ACTIVE, titulado “Investigación y desarrollo de nueva generación de productos funcionales con capacidad de interacción con el entorno en evolución”, en el que TECCI CIRCUITOS IMPRESOS S.L. participa junto con Maier, Cikautxo, Grupo Delta Ediciones Digitales, Ampo, Lan Mobel Masermic y Ojmar tiene como objetivo desarrollar una nueva generación de productos funcionales con capacidad de interacción de forma activa con el entorno mediante la investigación industrial de innovadoras tecnologías de tratamiento de superficies versátiles y adaptables a los procesos de producción de las empresas.
Número de expediente HAZITEK ESTRATÉGICO: ZE – 2019 / 00009
Actuación cofinanciada por el Gobierno Vasco y la Unión Europea a través del Fondo Europeo de Desarrollo Regional 2014-2020 (FEDER)
